Agilent Technologies Medalist x6000 Uživatelský manuál stáhnout pdf

Agilent Medalist x6000

Automated X-ray Inspection (AXI)

Data Sheet

Industry-Leading 3D Inspection

Throughput Delivers Reduced

Conversion Costs, Reduced

Capital Expenditure and

High Defect Coverage

• The Agilent Medalist x6000 AXI

system offers extensive simul-

taneous 3D X-ray inspection of

double-sided panels at throughput

rates that match most line rates of

medium to high complexity printed

circuit board assemblies (PCBA).

• Provides uncompromised 3D

inspection for maximum fault

detection up to 95% of all manu-

facturing defects.

• Designed for in-line or off-line

automated X-ray process testing

of lead or lead-free solder joints

on PCBAs, with user conﬁ gurable

pass-thru or pass-back loading.

• Enables successful implementa-

tions through an easy-to-learn

and easy-to-use development

environment providing faster

time-to-market with high

quality results.

• Digital cross-sectional X-ray images

of solder joints are automatically

generated and analyzed. The

dynamic analysis measures joint

characteristics and compares

results against both learned and

user deﬁ ned thresholds.

Key System Parameters

Performance

Total panel Maximum image acquisition rate 32.3 cm

/sec (5 in

/sec)

test cycle time

Typical image acquisition rate

25.8 cm

/sec (4 in

/sec)

Positioning, alignment and automatic 20 sec

system adjustments

Minimum feature Joint pitch

0.3 mm & up (0.012 in & up)

detection capability

Short width

0.045 mm (0.0018 in)

Solder thickness 0.0127 mm (0.0005 in)

1 This is an estimate of time from one panel load to when the system is ready to load the next panel.

Panels above 17 inches (43.1 cm) long require repositioning and realignment.

2 Image acquisition rate is dependent on component’s opacity.

3 Panel setup contains all panel movement for load, unload, X-ray barrier control, mechanical positioning

and compensation, automatic system adjustments, and panel alignment. Alignment time is dependent on

the size of the panel. Left to right pass through mode.

4 Assuming pad width is 50% of pitch.

5 The reported values for minimum feature detection assume that the feature is in a single plane of focus

and that there are no X-ray absorbers in the X-ray path or in the immediate area of the feature other than

those found in a typical multi-layer printed circuit board.

eet

1 2 3 4

Shrnutí obsahu

Strany 1 - Agilent Medalist x6000

Agilent Medalist x6000 Automated X-ray Inspection (AXI)Data SheetIndustry-Leading 3D Inspection Throughput Delivers Reduced Conversion Costs, Reduced

Strany 2 - Test reporting and repair

2Defect detection capabilityAll typical components found in manufacturing of electronic PCBAs, such as:• ≥ 0.4 mm Ball Grid Array (BGA)• Column Grid

Strany 3 - Power and environmental

3SafetyDesignThe system is designed to prevent electrical, mechanical, or radiation hazards to the operator. The system is fully certiﬁ ed to meet all

Strany 4 - Related Web Resources

www.agilent.com/ﬁnd/emailupdatesGet the latest information on the products and applications you select. Related Web ResourcesFor more information on

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Agilent Technologies Medalist x6000 Uživatelský manuál

Procházejte online nebo si stáhněte Uživatelský manuál pro Multimetry Agilent Technologies Medalist x6000. Agilent Medalist x6000 Automated X Uživatelská příručka

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