Agilent Technologies HFBR 5203 Uživatelský manuál stáhnout pdf (Strana 4)

www.semiconductor.agilent.com

Data subject to change.

September 11, 2001

5988-4042EN

HFBR-0501 Environmental Test Data

MIL-STD-883 Units Units

Test Reference Test Conditions Tested Failed

Temperature 1010 200 cycles from -40 to +100°C, 1080 0

Cycle 15 minutes at extremes, 5 min. transfer.

[1]

HFBR-1521

200 cycles from -40 to +85°C, 1120 0

15 minutes at extremes, 5 min. transfer.

[1]

HFBR-2521

85/85 T

= 85°C, 85% relative humidity, 200 0

No bias, duration = 1,000 hours.

[1]

HFBR-1521

= 85°C, 85% relative humidity, 200 0

= 5 volts, duration = 1,000 hours

[1]

HFBR-2521

Wave Soldering 3 cycles and washes.

[2]

80 0

HFBR-1521

3 cycles and washes.

[2]

80 0

HFBR-2521

Manual Soldering 260°C, 10 seconds 30 0

HFBR-1521

30 0

HFBR-2521

Gross Leak 1014, Cond. D 3 hours soak in UV fluorescent dye at 90 psi. 20 0

Resistance to 2015 Brush after solvent immersion. 30 0

Solvents

Vibration Variable 2007, 20 G min., 20 to 2000 Hz. 20 0

Frequency Condition B 4, 4 minute cycles each X, Y, Z.

Terminal Strength 2004 1 lb. tension, 8 oz. bending stress. 24 0

Mechanical Shock 2002, 5 blows each X1, X2, Y1, Y2, Z1, Z1 20 0

Condition B 1500 G, 0.5 msec. pulse.

ESD Method 3015 Human body model @ 8000 V 3 0

HFBR-1521

Human body model @ 2000V 3 0

HFBR-2521

Notes:

1. Devices were preconditioned with 10 second, 260°C solder dip and 20 cycles, -40°C to 85°C, temperature cycle.

2. Agilent procedure: 3 second flux cycle, 2 minute preheat at 95°C, 5 second wave solder at 255-265°C, 7 minute

cleaning at 60-70°C.

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